Plato® Desoldering Braid

Desoldering Braid is used to remove solder, which allows components to be replaced and excess solder to be cleaned off. Plato® desoldering braid combines innovative product design with proprietary processing. All this plus exacting quality control makes Plato® a premium name in wick!

Advanced Braid Design
To ensure surface area created by the one-over, one under construction enhances the absorbtion and trapping of molten solder.

Ultra-Pure Process
To ensure fast, reliable wicking action, the copper braid is cleaned using a proprietary, multi-stage process that removes oxidation and other residues before flux is added.

Vacuum-Packaged
For longer shelf life, Plato® desoldering braid is vacuum sealed in durable clear plastic to protect it from moisture and other environmental elements.

ESD-Safe Bobbins
Plato desoldering braid comes in static dissipative bobbins (except 25' , 50' and 100' spool) for static sensitive environments.

 

Plato®-Wick XL is designed for quick and safe desoldering printed circuit board components, terminals, lugs, and wire wrap pins, and removing bridges, icicles and unwanted solder.
         

       

 

                             
Plato®-No Clean Wick is specially formulated to improve wicking action and remove solder faster than conventional wick.  Any remaining residue is halide free and non-conductive; post cleaning is generally not required.  Since Plato®- Wick XLNC absorbs solder faster, dwell time per solder joint is reduced, shortening the time necessary for the operator to complete the task which limits risk of damage to the product being repaired.

 


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